Cleanrooms

Wet processes

  • Cleaning
  • Texturing
  • NAOS

Dry processes

Wet/dry processes

  • Slurry-based CMP (Chemical-Mechanical Planarization)

Deposition techniques

Doping techniques

  • Diffusion (POCl3, B2H6)
  • Temperature-controlled Implantation (P, B, BF2)
  • PECVD in-situ
  • Epitaxy in-situ (p-type)

Annealing techniques

  • Furnaces (N2, FG)
  • Rapid Thermal Annealing (N2, FG)

Oxidation

  • Wet
  • Dry

Photolithography

  • Feature size < 5 micron

Substrate size

  • Wafers: 4 inch (circular shape)
  • Quarts: 4 inch
  • Glass sheet: max 10 x 10 cm2

Affiliations

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