AC Metal 2
Apparatus |
| AC450 No. 9 |
Supplier | Alliance Concept | |
Location | P.00.390 | |
Main purpose | Sputter deposition | |
System layout | RF magnetron sputter deposition (4 x 107,mm target) RF sputter etching | |
Gasses | Ar, N2 | |
Power supply | 600W Huttinger RF source for deposition 300 W Huttinger RF source for sputter etch | |
Process information | standard materials: Nb, MoRe, AlSi(99%/1%), Ti optional materials: Al, TiN (reactive) NOTE: superconductors in AC-Metal 2 | |
| Facilities | static and dynamic deposition reactive sputtering (with N2) | |
Specimen | max. 100mm wafers, small pieces allowed | |
Equipment owner | Marinus Fischer +31 628906207
Bas van Asten (back-up) +31 642481091 |