EVG-620 NUV
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Apparatus | NUV Photo lithography |
Supplier | EVgroup |
Apparatus type | EVG 620 |
Function | Mask aligner |
Main Purpose | Photo lithography for thin film structuring |
Main Characteristics | NUV-source (320-365nm), approx. 13mW/cm² |
Facilities | Hard/soft, vacuum contact options Backside alignment option Proximity exposure |
Typical Application | Alignment and exposure of photoresist |
| Specimen | 5 mm to 100 mm wafers. Maximum thickness (substrate and mask): 10mm |
Equipment Owner | Brian van den Bulk |
| +31-634081404 | |
| B.P.vandenBulk@tudelft.nl | |
Eugene Straver (back up) | |
| +31-618242212 | |
| E.J.M.Straver@tudelft.nl |