This page contains the materials that can be deposited in one of the PVD or CVD tools. For the actual status of targets and precursors in the equipment please check the reservation system or ask the equipment owner.

1. PVD

1.1 Sputtering

Al, AlSi (1%), AIN, Al2O3B, Cr, Ge, ITO, Mo, MoRe, Nb, Ni, NiCr, Si, SiO2, Si3N4 Ti, W


1.2 Evaporation

Al, Al2O3, Ag, Au, AuPd, C, Co, Cr, Cu, Cu2O, Ge, Mo, Ni, NiCr, Pt, Si, SiO2, Ti, TiO2, V, W


2. CVD

2.1 Thermal CVD

SiO2 by oxidation (Tempress tube 2)

Si3N4 stoichiometric or low-stress (Tempress tube 4)

CNT's, graphene (First Nano)


2.2 PE-CVD

SiO2, Si3N4, SiC, a-Si


2.3 ALD

Al2O3, AIN, TiO2, TiN, HfO2, SiO2, Nbn, Nb2O5, Ta2O5 and Pt