FEI FIB/SEM Helios G4 CX

Apparatus

  

FEI Helios G4 CX

Supplier

 

FEI; www.fei.com

Location

 

TN D016 (VLLAIR)

Function

 

Imaging, nanofabrication, TEM lamella preparation and 3D slice and view

Main purpose

 

Nano Fabrication by ion milling

Ion or electron beam induced deposition

TEM lamella preparation in semi-automatic workflow

3D cross sectioning by slice and view

Main characteristics

 

SEM: FEG, 0.2-30kV, resolution 1nm

FIB1: liquid GA ion source, 5-30 kV, 1 pA-50nA, spot > 10nm

FIB2: multi beam gas injection system for deposition of W, SiO2 and Pt, and for etching by XeF2

TEM lamella preparation with easy lift system

Slice and view including 3D reconstruction sofware

Facilities

 

5-axes micromanipulator (Easy Lift EX)

EDX

Low energy ion source (Ar, Xe, Ne, O2, H2) 10-500 V

Specimen

 

Max. 4 inch in diameter, max 10 mm thickness

Equipment owner

 

Hozanna Miro

h.miro@tudelft.nl

+31 650559998

 

Lodi Schriek (back-up)

L.N.Schriek@tudelft.nl

+31 634321293