Mihai Lefter
PhD student at the Computer Engineering Group of the Faculty of Engineering, Mathematics and Computer Science (EEMCS/EWI), Delft University of Technology.
3DIM3: (b) 3D memory hierarchy
3DIM3 (3D-TSV Integration for Multimedia and Mobile applications) aims at providing novel system architectures and design methodologies tailored for the specific challenges and opportunities provided by the emerging 3D TSV integration technology.
3D memory hierarchies (physical and logical location of caches, implementation, etc.), in the context of multi-media and mobile applications.