Publicaties

• 2024

  Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste

  A combined experimental and ab initio study
  Wei Chen / Xu Liu / Zhoudong Yang / Xu Liu / Dong Hu / Xi Zhu / Xuejun Fan / Guoqi Zhang / Jiajie Fan

• 2024

  Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

  Shizhen Li / Xu Liu / Chenshan Gao / Shaogang Wang / Jun Li / Huaiyu Ye / Guoqi Zhang / Shaohui Wu

• 2024

  Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

  Wei Chen / Xu Liu / Dong Hu / Xu Liu / Xi Zhu / Xuejun Fan / Guoqi Zhang / Jiajie Fan

• 2023

  Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

  Shizhen Li / Jing Jiang / Xu Liu / Shaogang Wang / Zhonghua Zhang / Huaiyu Ye

• 2023

  High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging

  Insights from constitutive and multi-scale modelling
  Dong Hu / Cheng Qian / Xu Liu / Leiming Du / Zhongchao Sun / Xuejun Fan / Guoqi Zhang / Jiajie Fan

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